Your Innovation Our Manufacturing Power

End-to-end manufacturing from design to delivery

From PCB design to full product assembly, we drive global innovation with precision and agility. Our cloud-enabled facilities streamline development, testing, and scalable manufacturing across electronics and IoT.

About Rapidise

We Are Transforming the ODM Landscape with Innovation and Speed

Rapidise offers world-class IoT & AI Product, Design, Development, Rapid Prototyping, Supply Chain Management, Electronics Manufacturing, and Full Product Assembly.

Million PCBA Manufactured.

Core Industries Served

Consumer Electronics

Smart/Connected Keyfobs

Smart Home & Office Devices

Home Diagnostic Devices

Connected Appliances

Smart Camera Devices

Indoor/Outdoor Tracking

IoT & Industry 4.0

Machine Monitoring

IoT Factory Automation

Predictive Maintenance

People Management Evac

M2M

Security & Surveillance

Computer vision

Sensor Fusion

Machine Learning

Image Tuning

Industrial Design

Healthcare

Connected App Development

Health Devices & Wearables

Connectivity Support

Cloud-based Development

Remote Diagnostics

Automotive

Movement Detection

Mobile Distraction Detection

Drowsiness Detection

Driver Seat Belt Detection

Driver Health Monitoring

Traffic Light Monitoring

Pedestrian Alert

Trusted Partners

Our Services

Manufacturing Services

At Rapidise, we provide end-to-end electronic design validation services, ensuring that your automotive systems meet the highest industry standards for performance, safety, and reliability. We specialize in automotive electronics design validation for ADAS, infotainment systems, and safety-critical components, ensuring they comply with ISO 26262 and other automotive safety standards.

We Provide

Design Review and Verification

Simulation and Modeling

Design for Manufacturability (DFM)

Firmware and Software Validation

Rapidise specializes in automotive-grade PCB assembly services, delivering high-quality, reliable PCBs for automotive systems such as ADAS, infotainment, sensor systems, and electronic control units (ECUs). Our expertise in surface mount technology (SMT), through-hole technology (THT), and dual in-line package (DIP) assembly ensures compliance with automotive standards like IATF 16949, AEC-Q100, and ISO 26262.

We Provide

DIP (Dual In-Line Package) Assembly

Turnkey and Partial Turnkey Solutions:

Through-Hole Technology (THT) Assembly

Surface Mount Technology (SMT) Assembly:

Rapidise delivers comprehensive supply chain and sourcing services to support automotive product development. We ensure that automotive-grade components are sourced from trusted suppliers, complying with automotive standards such as IATF 16949, ISO 26262, and AEC-Q100. Our global sourcing capabilities ensure that we meet the strict quality requirements for automotive systems, including ADAS, safety systems, infotainment, electronic control units (ECUs), and autonomous driving systems. With a focus on lead time optimization, cost-effective sourcing, and JIT delivery, we provide seamless supply chain management for your automotive systems, ensuring timely and cost- effective production.

We Provide

Procurement Management

Cost Optimization

Automotive Logistics & JIT Delivery

Firmware and Software Validation

Rapidise offers specialized mold and enclosure manufacturing services for electronics, ensuring that your automotive systems meet the highest standards of performance, durability, and reliability. We provide automotive-grade enclosures for sensor systems, electronic control units (ECUs), ADAS systems, infotainment, and electric vehicle components.

We Provide

Injection Molding Services

Vacuum Forming and Thermoforming

Surface Finishing and Aesthetics

Waterproof and Ruggedized Enclosures

Thermal and EMI Management

Lorem ipsum dolor sit amet, consectetur adipiscing elit. Ut elit tellus, luctus nec ullamcorper mattis, pulvinar dapibus leo.Lorem ipsum dolor sit amet, consectetur adipiscing elit. Ut elit tellus, luctus nec ullamcorper mattis, pulvinar dapibus leo.Lorem ipsum dolor sit amet, consectetur adipiscing elit. Ut elit tellus, luctus nec ullamcorper mattis, pulvinar dapibus leo.

We Provide

Rapid Prototyping

Iterative Refinement

Proof of Concept (PoC)

Compliance and Certification Preparation

Prototype Variants

We Provide

Mechanical Assembly

Cable and Wire Harness Assembly

Electro-Mechanical Assembly

System Integration

We Provide

Electrical Testing

Incoming Materials Inspection

Functional Testing

In-Process Inspection Assembly Line Monitoring

Reliability and Environmental Testing

In-Process Inspection- PCB Inspection

Automotive Testing and Compliance

Software and Firmware Validation

We Provide

Protective Packaging- Anti- Static Packaging

Protective Packaging- Moisture- Resistant Packaging

Retail Packaging- Consumer-Friendly Design

Bulk Packaging for business-to-business

Regulatory Compliance Packaging

We Provide

Green Material Sourcing

Compliance with Environmental Standards

Electronic Waste Management

Carbon Management

Our Services

Manufacturing Capabilities

Infrastructure of 12 SMT lines and 14 Assembly Lines with capacity to manufacture 20+ Million Units annually
World-class manufacturing facilities certified for ISO 9001, IATF 16949, ISO 45001, ISO 18001, ISO 13485 Standards
Electromagnetic Testing (EMI & EMC), ESD (Electrostatic) Control workstation
Thermal, Humidity, Insulation Testing, Endurance & Aging Testing
Clean room with class 100,000
Climatic Chambers (Hot, Cold, and Humid)
Component Verification and end-to-end Traceability
In-line Solder Paste Inspection (Make: Kohyoung)
3D Automatic Optical Inspection (Maker: Omron)
Continuous optic monitoring of reflow oven (Make: KIC)
PCB Cleaning (Make: Unitech)
Nitrogen and lead-free compatible soldering (Make: Vitronics)
In-line X-Ray Machine (from Germany) and Shimadzu (Japan)
Pin insertion machine (Make: TE PSI)
Selective Soldering (Make: ERSA)
Component mounting machine Capability:
- Min : 0402mm/ 03015 inch
- Max : 102*102*T 25.4 mm
- Accuracy : 30 Micron

Location

Our Mechanical, IoT & AI-based Design and Development Centers

Infrastructure Capability

SPI Machine

3D Inspection
Zero-defect through AI-Powered
Integration with MES for 100% traceability
Best-in-class Measurement Accuracy and Inspection Reliability

AOI Machine

Optical Resolutions: 12.5 Micron
Maximizing good-quality throughput by using M2M*1 system
focusing on quality
3D Inspection
Inspection item :Component height, lift, tilt, missing or wrong component, wrong polarity, flipped component etc.
Integration with MES for 100% traceability

Pick & Place Machine

Dual lane capability
CPH: 80,000
Component mounting
Min : 0402mm/ 01005 inch, Max : 120*90*T 30mm
Placement Accuracy : 30 Micron
Feeder Capacity: Tape/Reel/Stick
Mounts Flip Chip, BGA, µBGA, MELF, QFN, CSP, Fine Pitch Components up to 16 mil
Integration with MES for 100% traceability

Reflow Oven Machine

9 Heating Zone
3 Cooling Zone
Nitrogen Compatible
KIC 24X7 online monitoring profiler

X-Ray Machine

In Line 3D X-Ray Machine with CT Scan
X-ray inspection with resolution as low as 6 µm
High-power 3D AOI camera technology
Detection of invisible solder joints at the bottom of the package

ICT Machine

Assured detection of solder bridging in the production PCB, missing components, the incorrect value of  inserted components, the wrong type of component inserted, misaligned component.